Data/hora: 16/06/2024 22:46:40

Biblioteca(s): 	Embrapa Instrumentação.	
Data corrente: 	26/02/2005	
Data da última atualização: 	03/03/2010	
Autoria: 	ZUCOLOTTO, V.; GREGÓRIO JR. R.; MATTOSO, L. H. C.	
Título: 	Thermal and mechanical properties of conductive nanocomposites incorporating polymer-modified carbon black.	
Ano de publicação: 	2004	
Fonte/Imprenta: 	In: ENCONTRO DA SBPMat, 3. Foz do Iguaçu, 2004. Resumos...Foz do Iguaçu, 2004.	
Idioma: 	Inglês	
Conteúdo: 	Artificial vesicles comprising concentric lipid bilayers have been widely exploited as building blocks for artificial membranes, in studies to mimic the drug absorption processes and to investigate membrane interaction with drugs and proteins. Lipid vesicles are aIso candidate materiaIs for controlled drug delivery, but this requires steric stabilization for the vesicles may be rapidly cleared from the blood by physiological species. In this work we report on the immobilization and stabilization of layers of 1,2-dipalmitoyl-sn-Glycero-3-[Phospho-rac-(l-glycerol)] (Sodium Salt) (DPPG) in layer-by-layer (LbL) films, altenated with poly(amidoamine) G4 (PAMAM) dendrimer. Thin films containing up to 20 PAMAM/DPPG bilayers were assembled onto glass or/and silicon wafers substrates. The growth of the multilayers was obtained by immersing the substrates into the PAMAM and DPPG solutions for 10 min., respectively. After each immersion, the films were rinsed with pure water. The concentration of the solutions was set at 1 g/L for PAMAM and 1 mM for DPPG. The formation of PAMAM/DPPG multilayers was confirmed by Fourier transform infrared spectroscopy (FTIR). The films exhibited a very flat morphology, as visualized by atomic force microscopy (AFM), with a roughness of 5 nm for a 3-bilayer film. Film thickness was estimated by AFM to be ca. 2.8 nm per PAMAM/DPPG bilayer.	
Palavras-Chave: 	Filmes; Polímeros; Propriedades mecânicas.	
Categoria do assunto: 	--	
Registro original: 	Embrapa Instrumentação (CNPDIA)	
Exemplares: 	CNPDIA - (8678-1) - UMT - SP - -- - PROCI-04.00149 -  - 2004.00149 - DIS